Electronics engineering (500)

publisher: Springer
year: 2016
description:This book presents wet chemical sol-gel and hydrothermal methods for 1D oxide nanostructure preparation. These methods represent an attractive route to multifunctional nanomaterials synthesis, as they are versatile, inexpensive and, thus, appropriate...

publisher: Springer
year: 2017
description:This book is dedicated to the new two-dimensional one-atomic-layer-thick materials such as graphene, metallic chalcogenides, silicene and other 2D materials. The book describes their main physical properties and applications in nanoelctronics, photon...

publisher: Springer
year: 2011
description:This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, ...

publisher: Springer
year: 2018
description:This book presents an introduction to the analysis of general movements in 3D space, especially for movements of the human body. It is based on the lecture notes of a class on 3D Kinematics, which the author has been holding in the Master Degree Prog...

publisher: Springer
year: 2017
description:This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectron...

publisher: Springer
year: 2017
description:The 3rd International Congress on Energy Efficiency and Energy Related Materials (ENEFM2015) was held from 19–23 October 2015. This congress focused on the latest developments of sustainable energy technologies, materials for sustainable energy appli...

publisher: Springer
year: 2018
description:This book describes the design, fabrication and evaluation of a polymer-based neural interface for a cochlear electrode array, reviewed in terms of fabrication process, functionality, and reliability. Polymer-based devices have attracted attention in...

publisher: Springer
year: 2018
description:This book is a valuable resource to deeply understand the technology used in 3D cameras. In this book, the authors summarize and compare the specifications of the main 3D cameras available in the mass market. The authors present a deep metrological a...

publisher: Springer
year: 2017
description:This brief examines mathematical models in nonsmooth mechanics and nonregular electrical circuits, including evolution variational inequalities, complementarity systems, differential inclusions, second-order dynamics, Lur'e systems and Moreau's sweep...

publisher: Springer
year: 2017
description:This book contains the Proceedings of the International Conference on Robot Ethics, held in Lisbon on October 23 and 24, 2015. The conference provided a multidisciplinary forum for discussing central and evolving issues concerning safety and ethics t...

publisher: Springer
year: 2018
description:This book introduces a family of new methods for accurate and robust spectral testing and fills an information gap, as the requirements in standard test have grown increasingly challenging in recent high precision testing, especially as the device pe...

publisher: Springer
year: 2018
description:This book introduces an approach to active system control design and development to improve the properties of our technological systems. It extends concepts of control and data accumulation by explaining how the system model should be organized to im...